SUS630T Steel Material 1.0-2.0mm Thickness PCB Lamination Press Plate ESSP-S630T
SUS630T Steel Material 1.0-2.0mm Thickness PCB Lamination Press Plate ESSP-S630T
1.Introduction of SUS630T Steel Material 1.0-2.0mm Thickness PCB Lamination Press Plate ESSP-S630T
PCB/CCL Press Plate ESSP-S630 is using high quality made-in-china raw material steel with the steel model of SUS630T, which has more competitive pricing advantage with the great quality reliability.
It has been working reliably in the PCB or CCL laminator as our mature and reliable high-precision lamination steel plate special for PCB or CCL lamination purpose.
|  Models
Items | SUS630T |
| Mass-Lam plate | Pin-lam plate |
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Width | ≤1300 | ≤1300 |
| Length | ≤2410 | ≤2410 |
| Thickness tolerance | ±0.10 | ±0.10 |
| Surface roughness (um) | Ra≤0.15 Rz≤1.5 | Ra≤0.15 Rz≤1.5 |
| Positioning hole to hole tolerance | -- | +/-0.10 |
| Standard bushing slot tolerance | -- | +0.10/-0mm |
| Warpage degree | ≤3mm/M | ≤3mm/M |
| L/W size tolerance | ±1mm | ±1mm |
| Yield strength | ≥1175 N/mm2 | ≥1175 N/mm2 |
| Tensile strength | ≥1400 N/mm2 | ≥1400 N/mm2 |
| Extensibility | ≥5% | ≥5% |
| Hardness HRC | 50HRC±2 | 50HRC±2 |
| Work temperature | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03 | ≤0.03 |
| Diagonal deviation | 1-2mm | 1-2mm |
| Thermal conductivity | ≥18W/MK at 300℃ | ≥18W/MK at 300℃ |
| Average thermal expansion coefficient (10-6/℃) | 10~12 | 10~12 |
2. Product features of SUS630T Steel Material 1.0-2.0mm Thickness PCB Lamination Press Plate ESSP-S630T
Key features of Printed Circuit Board PCB/CCL Press Plate ESSP-S630T:
1). More competitive pricing advantage with reliable lamination performance.
2). It has better thermal conductivity and thermal expansion coefficient, which can save more cost and energy in the production process.
3). It features high corrosion resistance and hardness.
4). Suitable for various types of lamination steel plate washing machines.
3. Technical parameters of SUS630T Steel Material 1.0-2.0mm Thickness PCB Lamination Press Plate ESSP-S630T
1). Steel material: SUS630T.
2). Normal thickness (mm): 1.0, 1.2, 1.5, 1.6, 1.8, 2.0.
3).Normal sizes of PCB lamination steel plate/press plate (L*W in mm): 1500*1295/1300*800/1295*787/1295*1613/1295*1143/1295*787/1285*750/1280*1120/1280*1070/1280*970/1270*1118/1270*1070/1143*660/673*571/660*508/24"*28".
4). Normal sizes of copper clad laminate CCL lamination steel plate/press plate (L * W in mm):
1910*1270/2210*1270/2220*1270.
4. Performance parameters of SUS630T Steel Material 1.0-2.0mm Thickness PCB Lamination Press Plate ESSP-S630T
| Steel material | SUS630T. |
| Normal thickness (mm): | 1.0, 1.2, 1.5, 1.6, 1.8, 2.0. |
| Normal sizes of PCB lamination steel plate/press plate (L*W in mm): | 1500*1295/1300*800/1295*787/1295*1613/ 1295*1143/1295*787/1285*750/1280*1120/ 1280*1070/1280*970/1270*1118/ 1270*1070/1143*660/673*571/660*508/24"*28". |
| Normal sizes of copper clad laminate CCL lamination steel plate/press plate (L * W in mm): | 1910*1270/2210*1270/2220*1270. |
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SUS630T 2210 X 1270 Steel Pcb Laminate Material 1.0 - 2.0mm PCB Lamination Press Plate Images
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