High Molecular Weight Polymer Lamination Pad with 4mm-6.5mm Thickness Non-slip

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Lamination Pad [20]
Hot Press Cushion Pad [16]
Lamination Press Rubber Pad [13]
Wood Press Cushion Pad [11]
Solar Rubber Cushion pad [11]
Printed Circuit Board Laminate Plate [11]
Copper Clad Laminate Plate [13]
Carrier Cover Plate [15]
Heat Press Kraft Paper [10]
Laminating Film Roll [27]
Wafer Frame Ring [14]

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High Molecular Weight Polymer Lamination Pad with 4mm-6.5mm Thickness Non-slip

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High Molecular Weight Polymer Lamination Pad with 4mm-6.5mm Thickness Non-slip

Product Description: The Lamination Pad is a premium product designed to provide exceptional cushioning and support during the CCL hot press process. Made from high molecular weight polymer, this pad ...

Product Tags:

4mm-6.5mm Thickness Lamination Pad

Non-slip Bottom CCL Hot Press Cushion Pad

Removable Cover CCL Buffering Pad

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